Market Introduction

With the continuous improvement in the computational power and efficiency of laptops, the demand for heat dissipation is also increasing. Currently, the primary heat dissipation method for laptops on the market relies on blower fans paired with thermal modules. However, with the rise of gaming and AI applications, laptops are moving towards higher performance and stronger computing capabilities, making heat dissipation conditions more demanding. Ensuring that laptops maintain excellent performance in highly computational environments is crucial, and heat dissipation plays the most significant role.

Diverging from the past, when laptops were bulky, the trend in laptop development is towards slimness and lightness. Thermal parts will continue to evolve towards being lighter and thinner. In addition to fans, heat pipes, vapor chambers, and modules are widely used. Materials are also becoming more diverse, incorporating not only copper and aluminum but gradually adopting stainless steel. Overall, the thermal technology of laptops will continue to develop towards higher performance and greater slimness.

Application: Laptop /Gaming Notebook /AI Notebook