Immersion Cooling System

Product Introduction

The immersion cooling technology is a method of cooling electronic components by directly immersing IT equipment into dielectric liquids. Compared with the conventional air cooling scenario, immersion cooling dissipates the heat from electronic components much more efficiently and is able to realize nearly 100% heat capture for reusing the “FREE” heat in residential, commercial, and industrial sectors.


Immersion Cooling & Energy Reusage

Different from common air-conditioning refrigeration, Immersion Cooling Technology utilizes the principle of low-energy heat exchange to transfer a large amount of waste heat from IT equipment in the data center through liquid to high-density and effective transmission of heat energy to waste heat reuse areas, such as building heating and greenhouse cultivation farm.

Advantages and Characteristics

Based on the recommendations and using habits of IT equipment experts, as well as data center infrastructure experts, our Immersion Cooling system is designed to be closer to end-users and we look forward to greatly improving user-friendly experience.

Improving Thermal Performance(+1000%)

Immersion Cooling is highly efficient and can provide higher heat dissipation efficiency than air cooling. It provides a suitable operating environment for IT equipment and increases the possibility of overclocking.

Noise Reduction(-25%)

For no fans are required for cooling, Immersion Cooling systems are generally quieter than traditional air cooling ones.

Lessening Space Requirement(-75%)

Immersion Cooling Solution utilizes space more efficiently than air cooling solution and is suitable for installations where space is limited.

Lower Energy Consumption(-50%)

Immersion Cooling can be more energy efficient because it does not require the fans used in traditional air cooling systems.

Reducing Risk of PC Damage(-50%)

For electronic components are immersed in a non-conductive liquid, the risk of damage to IT equipment caused by dust, moisture or other contaminants in the air is reduced.

Data Center Specialists

Infrastructure

Immersed Cooling Technology is the best energy saving and space utilization solution for Liquid Cooling IDC.

IT Equipment

Immersion Cooling Technology replaces fans with the superior heat transfer performance of coolant which can significantly reduce the energy consumption of IT equipment and save rack space.

Operators

The technology is one of the best options for maximizing energy space efficiencies in date centers.

(Listed but not limited! Custom Design Available!)

Model & Application All-in-one IT Test Bed & Demo Enterprise & Colocation Datacenters
2U3KW 4U7KW 25U60KW 40U60KW
Heat Transfer Specifications
Cooling Capacity – liquid to air
(KW; ambient 25oC)
3 7 n/a
Cooling Capacity – liquid to liquid
(KW; facility water temp. 32oC)
n/a 60
Coolant Recommendations hydrocarbon based
Coolant Viscosity Recommendations
(cSt @ 40oC) 
<10
Max. Coolant Operating Temperature
(oC)
50
Specifications for IT specialists
IT Capacity
(U)
2 4 25 40
Form Factor EIA 19” / OCP 21” 
Depth
(mm; tank interior)
850 850/950
Max. Coolant Volume
(Liter)
90 120 580 / 640
(EIA 19″; 850/950mm)
930 / 1050
(EIA 19″; 850/950mm)
IT Power Supply by external PDU(not included)
Specifications for datacenter infrastructure specialists
Dimensions – System
(m; L*W*H)  
0.97*0.48*1.33   0.97*0.65*1.33  2.72*0.8*1.5 3.42*0.8*1.5
Dimensions – CDU
(m; L*W*H)  
n/a 0.77*0.8*1.5
Dimensions – Tank
(m; L*W*H)  
1.35*0.8*1.37 2.05*0.8*1.37
Footprint – System
(m2
0.47 0.63 2.18 2.7
Footprint – CDU
(m2)  
n/a 0.62
Footprint – tank
(m2)  
1.08 1.64
Weight – System
(KG; Dry / Wet)
240 / 320 270 / 370 440 / 960
(EIA 19″; 950mm depth)
640 / 1490
(EIA 19″; 950mm depth)
Weight – CDU
(KG; Dry / Wet)
n/a 90 / 100 90 / 100
Weight – tank
(KG; Dry / Wet)
350 / 860 550 / 1390
Required Floor Loading – System
(KN/m2)
681 588 8
(without IT loading)
9
(without IT loading)
System Power Supply 3P 220/380V 50/60Hz
Sytem Connection 3P+E+N 20A IEC 60309 
Max. Power Consumption
(KW; full operating mode)
1.5 2.4
partial PUE 1.18 1.04
Redundancy  n/a 1+1
Min. Facility Water Supply
(LPM)
n/a 150
Water Supply Connection JIS flange 50mm

Innovation with quality!
Experience the excellence!

Vertical Thermal Management Solution Provider