The immersion cooling technology is a method of cooling electronic components by directly immersing IT equipment into dielectric liquids. Compared with the conventional air cooling scenario, immersion cooling dissipates the heat from electronic components much more efficiently and is able to realize nearly 100% heat capture for reusing the “FREE” heat in residential, commercial, and industrial sectors.
Different from common air-conditioning refrigeration, Immersion Cooling Technology utilizes the principle of low-energy heat exchange to transfer a large amount of waste heat from IT equipment in the data center through liquid to high-density and effective transmission of heat energy to waste heat reuse areas, such as building heating and greenhouse cultivation farm.
Based on the recommendations and using habits of IT equipment experts, as well as data center infrastructure experts, our Immersion Cooling system is designed to be closer to end-users and we look forward to greatly improving user-friendly experience.
Immersion Cooling is highly efficient and can provide higher heat dissipation efficiency than air cooling. It provides a suitable operating environment for IT equipment and increases the possibility of overclocking.
For no fans are required for cooling, Immersion Cooling systems are generally quieter than traditional air cooling ones.
Immersion Cooling Solution utilizes space more efficiently than air cooling solution and is suitable for installations where space is limited.
Immersion Cooling can be more energy efficient because it does not require the fans used in traditional air cooling systems.
For electronic components are immersed in a non-conductive liquid, the risk of damage to IT equipment caused by dust, moisture or other contaminants in the air is reduced.
Immersed Cooling Technology is the best energy saving and space utilization solution for Liquid Cooling IDC.
Immersion Cooling Technology replaces fans with the superior heat transfer performance of coolant which can significantly reduce the energy consumption of IT equipment and save rack space.
The technology is one of the best options for maximizing energy space efficiencies in date centers.
(Listed but not limited! Custom Design Available!)
Model & Application | All-in-one IT Test Bed & Demo | Enterprise & Colocation Datacenters | ||||||
2U3KW | 4U7KW | 25U60KW | 40U60KW | |||||
Heat Transfer Specifications | ||||||||
Cooling Capacity – liquid to air (KW; ambient 25oC) |
3 | 7 | n/a | |||||
Cooling Capacity – liquid to liquid (KW; facility water temp. 32oC) |
n/a | 60 | ||||||
Coolant Recommendations | hydrocarbon based | |||||||
Coolant Viscosity Recommendations (cSt @ 40oC) |
<10 | |||||||
Max. Coolant Operating Temperature (oC) |
50 | |||||||
Specifications for IT specialists | ||||||||
IT Capacity (U) |
2 | 4 | 25 | 40 | ||||
Form Factor | EIA 19” / OCP 21” | |||||||
Depth (mm; tank interior) |
850 | 850/950 | ||||||
Max. Coolant Volume (Liter) |
90 | 120 | 580 / 640 (EIA 19″; 850/950mm) |
930 / 1050 (EIA 19″; 850/950mm) |
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IT Power Supply | by external PDU(not included) | |||||||
Specifications for datacenter infrastructure specialists | ||||||||
Dimensions – System (m; L*W*H) |
0.97*0.48*1.33 | 0.97*0.65*1.33 | 2.72*0.8*1.5 | 3.42*0.8*1.5 | ||||
Dimensions – CDU (m; L*W*H) |
n/a | 0.77*0.8*1.5 | ||||||
Dimensions – Tank (m; L*W*H) |
1.35*0.8*1.37 | 2.05*0.8*1.37 | ||||||
Footprint – System (m2) |
0.47 | 0.63 | 2.18 | 2.7 | ||||
Footprint – CDU (m2) |
n/a | 0.62 | ||||||
Footprint – tank (m2) |
1.08 | 1.64 | ||||||
Weight – System (KG; Dry / Wet) |
240 / 320 | 270 / 370 | 440 / 960 (EIA 19″; 950mm depth) |
640 / 1490 (EIA 19″; 950mm depth) |
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Weight – CDU (KG; Dry / Wet) |
n/a | 90 / 100 | 90 / 100 | |||||
Weight – tank (KG; Dry / Wet) |
350 / 860 | 550 / 1390 | ||||||
Required Floor Loading – System (KN/m2) |
681 | 588 | 8 (without IT loading) |
9 (without IT loading) |
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System Power Supply | 3P 220/380V 50/60Hz | |||||||
Sytem Connection | 3P+E+N 20A IEC 60309 | |||||||
Max. Power Consumption (KW; full operating mode) |
1.5 | 2.4 | ||||||
partial PUE | 1.18 | 1.04 | ||||||
Redundancy | n/a | 1+1 | ||||||
Min. Facility Water Supply (LPM) |
n/a | 150 | ||||||
Water Supply Connection | JIS flange 50mm |
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Vertical Thermal Management Solution Provider
Tax ID: 16266820
Stock No.: 3483.TW