Slim Vapor Chamber is a vapor chamber cooling technology designed to have an ultra-thin profile while providing efficient heat transfer capabilities. It is a special variant of a vapor chamber developed specifically for installation in slim and compact electronic devices where space is limited, such as ultra-thin laptops, tablets and smartphones.
Slim Vapor Chamber are passive thermal management devices that utilize the latent heat associated with phase change to achieve high effective thermal conductance, similar to heat spreader. FCN develop flexible Slim Vapor Chamber with an ultra-thin thickness of <0.4 mm using composite materials, copper mesh as a wick, and copper pillars to support a vapor core.
SVC is much higher than the copper plate of the same size. SVC Conductivity ~ 6,000 W/mK (copper: 401 W/mK)
Bending Angle:10~15°
SVC Density: 2 gm/cm3 (copper: 8.9gm/cm3 )
Add construction to increase rigidity.
Thickness: < 0.4mm
Add construction to weak structural
Slim vapor chambers are known for their excellent thermal efficiency, allowing electronic devices to run cooler under heavy workloads, which can contribute to improved performance and longer device lifespan.
Slim Vapor Chamber (Listed but not limited! Custom Design Available!) |
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Dimension(L*W*H)(mm) | Flatness(mm) | Top/Bottom Layer Material(Copper/SUS/CM) |
Rated Power(W) | Delta T (°C) |
93.7*45.05*0.4 | 0.3 | C-CM | 7 | ≦5℃ |
51.4*70.4*0.3 | 0.3 | CM-CM | 6 | ≦4℃ |
110*130*0.35 | 0.25 | C-C | 8 | ≦5℃ |
49.8*103.9*0.27 | 0.3 | C-CM | 5 | ≦5℃ |
98.2*61.7*0.25 | 0.3 | C-CM | 5 | ≦5℃ |
45*60*0.3 | 0.3 | C-CM | 6 | ≦5℃ |
86.2*49.4*0.25 | 0.3 | C-CM | 7 | ≦5℃ |
100.7*52*0.25 | 0.3 | C-CM | 5 | ≦5℃ |
100.7*52*0.27 | 0.3 | C-C | 5 | ≦5℃ |
79.01*25.06*0.27 | 0.3 | S-S | 7.5 | ≦4℃ |
243*167*0.5 | 0.3 | C-C | 15 | ≦6℃ |
250*150*0.35 | 0.3 | F-F | 12 | ≦5℃ |
Foldable Slim Vapor Chamber Available for Custom Design
Innovation with quality!
Experience the excellence!
Vertical Thermal Management Solution Provider
Tax ID: 16266820
Stock No.: 3483.TW