Product Introduction
Cold Plate Liquid Cooling Technology is to operate by directly contacting various processors (high-density heat sources) in IT equipment with liquid cooling plates. The method of cooling the processor is achieved by circulating cooling fluid between the liquid cooling plate and the Cooling Distribution Unit (CDU). Traditional air cooling is still in demand in this application while a large amount of heat energy has been effectively transmitted to the datacenter air conditioning system through Liquid Cooling Technology.
Cold Plate Liquid Cooling Technology is to operate by directly contacting various processors (high-density heat sources) in IT equipment with liquid cooling plates. The method of cooling the processor is achieved by circulating cooling fluid between the liquid cooling plate and the Cooling Distribution Unit (CDU). Traditional air cooling is still in demand in this application while a large amount of heat energy has been effectively transmitted to the datacenter air conditioning system through Liquid Cooling Technology.
Advantages and Characteristics
Cold Plate Liquid Cooling can be more energy efficient because it reduces the number of fans used in traditional air-cooling systems.
Improving Thermal Performance(+1000%)
Cold Plate Liquid Cooling is highly efficient and can provide higher heat dissipation efficiency than air cooling. It provides a suitable operating environment for IT equipment and increases the possibility of overclocking.
Noise Reduction(-10%)
Cold Plate Liquid Cooling Systems are generally quieter than traditional air-cooling ones because there are fewer fans for cooling.
Lessening Space Requirement(-20%)
Cold Plate Liquid Cooling can be more energy efficient because it reduces the number of fans used in traditional air-cooling systems.
Easy for Replacement
Since the overall structure of Cold Plate Liquid Cooling is almost the same as that of air-cooling, air-cooling cabinet can be directly replaced without changing to Cold Plate Liquid Cooling ones in IDC.
Specialists Must-know
Datacenter Operators
Cold Plate Liquid Cooling Technology is one of the best options to reduce energy consumption and save space in IDC.
Infrastructure Specialists
Cold Plate Liquid Cooling Technology is the most convenient solution for converting air-cooled IDC to liquid-cooled IDC.
IT Equipment Specialists
Cold Plate Liquid Cooling Technology uses liquid cooling plates to replace heat sinks and fans. Thus it can significantly reduce the energy consumption of IT equipment and save space in IDC.
(Listed but not limited! Custom Design Available!)
| Model & Application | In-rack Solutions | In-row Solution | ||||||
| 80KW | 800KW | |||||||
| Heat Transfer Specifications | ||||||||
| Cooling Capacity – liquid to liquid (KW; ASHRAE Class W4) |
80 | 800 | ||||||
| Coolant Recommendations | PG 25 | |||||||
| Max. Coolant Flow Rate (LPM) |
70 | 800 | ||||||
| Max. Coolant Operating Temperature (oC) |
55 | |||||||
| Specifications for IT specialists | ||||||||
| Rack Type Support | EIA 19″ / OCP 21″ | |||||||
| Quick Disconnect Type (IT – manifold) |
UQD (or other specified type) | |||||||
| Quick Disconnect Type (manifold – CDU) |
UQD (or other specified type) | |||||||
| Manifold Selection (pairs; quick disconnect) |
40 (>42U rack) | 32(42U rack) | 20(42U rack) | 10(horizontal; EIA rack) | ||||
| Specifications for datacenter infrastructure specialists | ||||||||
| Dimensions – System (mm; D*W*H) |
987.6*448*4U | 1290*930*2120 | ||||||
| Weight (KG; Dry / Wet) |
55 / 60 | 900 / 1300 | ||||||
| System Power Supply | 48VDC | 1P 100-240VAC | 3P 220/380VAC 50/60Hz | |||||
| Sytem Power Connection | ORV3 bus bar | IEC 60320 C14 | 3P+E+N 40A IEC 60309 | |||||
| Max. Power Consumption (KW; single pump mode) |
0.8 | 7.5 | ||||||
| HMI Display (inch) |
4.3 | 15 | ||||||
| Communication Interface | 1 Modbus | VNC Server | Email Alarm | SNMP | WebUI | ||||||
| Pump Redundancy | 1+1 | |||||||
| Pump Hot Swap | Supported | Not supported | ||||||
| Min. Facility Water Supply (LPM) |
100 | 800 | ||||||
| Water Supply Connection | Stäubli CGB20(or UQD) | JIS 80mm flange | ||||||
| Cold Plate Overview | ||||||||
| CPU | GPU | |||||||
| Cooling Capacity (W) |
350 and above | 700 and above | ||||||
| Coolant | PG 25(or equivalent properties) | |||||||
| Platform | Intel / AMD | Nvidia | ||||||
Cold Plate Reference
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Cold Plate Reference
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