The thermal module is an essential component used for managing and regulating the temperature of devices or systems. Its primary function is to effectively dissipate the heat generated by various components, preventing overheating and ensuring that the device operates within a safe working temperature range.
The thermal modules typically include components such as heat sinks, fans, heat spreaders, vapor chamber, slim vapor chamber and heat pipes. It can be used individually or combined to form a complete heat dissipation system.
The modules are indispensable in many industrial and technological applications, ensuring the normal operation of equipment and extending its lifespan.
The thermal module is an essential component used for managing and regulating the temperature of devices or systems. Its primary function is to effectively dissipate the heat generated by various components, preventing overheating and ensuring that the device operates within a safe working temperature range.
The thermal modules typically include components such as heat sinks, fans, heat spreaders, vapor chamber, slim vapor chamber and heat pipes. It can be used individually or combined to form a complete heat dissipation system.
The modules are indispensable in many industrial and technological applications, ensuring the normal operation of equipment and extending its lifespan.
Advantages and Characteristics
Forcecon has a wide of range thermal module components and a very complete portfolio of products. The components are vertically integrated with Forcecon designs, manufactures and quality controls. The components include the following: fan, heat sink, heat pipe, heat spreader, vapor chamber and slim vapor chamber. We are worldwide thermal supply leader in Notebook and occupying mass market share. We are capable handling custom design and large manufacture operations.
Heat Pipe Solution
Utilizing multiple heat pipes to efficiently extract high thermal energy from the chip end. Power ranges from 30~50W for CPU and 60~120W for GPU.
Heat Pipe is regarded as one-dimension conductive component, using point-to-point transmission.
Vapor Chamber Solution
The vapor chamber solution effectively extract high-density thermal energy from the chip end. Power ranges from 50~70W for CPU and 90~175W for GPU.
Vapor chamber is regarded as two-dimension conductive component, using point-to-point transmission. High-density diffusion helps add heatload.
Heat Pipe + Vapor Chamber
In combination of heat pipe and vapor chamber, device heat is evenly distribute high thermal density, followed by rapid extraction by heat pipes. Power ranges from 60~90W for CPU and 90~200W for GPU.
Ultra-Thin Heat Pipe
Ultra-Thin Heat Pipe Version (Thickness < 1.5mm): Utilizing ultra-thin heat pipes to efficiently extract high thermal energy from the chip end. Power ranges from 35~50W for CPU and 60~110W for GPU.
Product Reference
| Thermal Module for Personal Computer (Laptop) | |||
| Screen Size (inch) |
TDP | Dimension L*W*H(mm) |
Conductive Component Inside |
| Laptop 16″ | CPU=35W GPU=85W AI Boost NPU |
Custom Design | |
| Laptop 15″ | CPU=45W AI Boost NPU |
||
| Laptop 14″ | CPU=70W GPU=210W AI Boost NPU |
||
| Laptop 14″ | CPU=45W AI Boost NPU |
||
| Laptop 16″ | CPU=75W GPU=150W |
134.6*345.1*18.95 | C1020 D6 C1020 D8 |
| Laptop 16″ | CPU=35W GPU=85W |
107*306*10.25 | C1020 D6 C1020 D5 |
| Laptop 15.6″ | CPU=75W GPU=150W |
344*140.5*13.73 | C1020 D6 C1020 D8 C1020 D10 |
| Laptop 15″ | CPU=60W GPU=100W |
365*150*18.3 | C1020 D6 C1020 D8 |
| Laptop 14″ | CPU=70W GPU=210W |
310.4*107*79*12.1 | C1020 D6 C1020 VC |
| Laptop 10″ | CPU=20W | 142.99*61.75*16.51 | C1020 D5 |
(Click for more info on PC / AIO / Gaming Thermal Module Components)
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