Product Introduction
Vapor Chambers are an advanced cooling technology that work on the same principles as heat pipes, but are designed to handle larger heat loads and provide more even heat spread over a larger surface area. It is a flat, sealed, thin structure commonly used to dissipate heat from high-power electronic components such as CPUs and GPUs in modern electronic devices and high-performance computing applications.
Vapor Chambers are an advanced cooling technology that work on the same principles as heat pipes, but are designed to handle larger heat loads and provide more even heat spread over a larger surface area. It is a flat, sealed, thin structure commonly used to dissipate heat from high-power electronic components such as CPUs and GPUs in modern electronic devices and high-performance computing applications.
Advantages and Characteristics
Vapor Chamber consists of a flat metal plate with a closed chamber inside. The chamber contains a small amount of working fluid, usually water or other lower boiling point liquid. The interior surface of the chamber is lined with a wicking material similar to that used in heat pipes. This wicking material ensures that the working fluid can be evenly distributed over the entire surface of the chamber.
Efficient Heat Dissipation
The vapor chamber can effectively spread heat to a larger surface area, ensuring a more uniform temperature and preventing hot spots.
Higher Heat Capacity
The vapor chamber can withstand a higher heat load than traditional heat pipes and is suitable for cooling high-power electronic components.
Thin Profile
The vapor chamber has a slim profile, allowing for better integration into slim and compact electronic devices.
Lower Thermal Resistance
Compared with solid metal heat sinks, vapor chambers have lower thermal resistance, allowing for more efficient heat transfer.
Gaming
In combination of heat pipe and vapor chamber, device heat is evenly distributing high thermal density, followed by rapid extraction by heat pipes. Power ranges from60~90W for CPu and 90~200w for GPU.
Product Reference
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Vapor Chamber (Listed but not limited! Custom Design Available!) |
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| Dimension (L*W*H) (mm) |
Heat Side Surface Flatness (mm) | Cool Side Surface Flatness (mm) |
Max (W) |
| 160.2*93.2*6.7 | 0.1 | 0.3 | 400 |
| 165.2*93.2*6.7 | 0.1 | 0.3 | 400 |
| 127.3*97.8*5.5 | 0.1 | 0.3 | 400 |
| 58.55*49.97*5.1 | 0.1 | 0.3 | 130 |
| 111*76*4.1 | 0.1 | 0.3 | 250 |
| 150*75.8*4.5 | 0.1 | 0.3 | 350 |
| 140*78*8.7 | 0.1 | 0.3 | 500 |
| 104*86*3.5 | 0.1 | 0.3 | 120 |
| 159.2*93.2*6.7 | 0.1 | 0.3 | 280 |
| 39.34*18.65*2 | 0.1 | 0.3 | 150 |
| 45*40*2 | 0.1 | 0.3 | 135 |
| 43.5*35*1 | 0.1 | 0.3 | 45 |
| 39.5*46*1.6 | 0.1 | 0.3 | 125 |
| 373.9*190*6 | 0.1 | 0.3 | 310.5 |
| 325.9*125*6 | 0.1 | 0.3 | 144 |
| 132.7*87.6*6.6 | 0.1 | 0.3 | 300 |
| 44*32*1.6 | 0.1 | 0.3 | 150 |
| 166.25*140*7.6 | 0.1 | 0.3 | 300 |
| 112.75*140*7.6 | 0.1 | 0.3 | 300 |
| 118*93.2*6.6 | 0.1 | 0.3 | 290 |
| 118*73.6*4.6 | 0.1 | 0.3 | 270 |
| 134.55*109*2.65 | 0.1 | 0.3 | 150 |
| 118*93.2*6.9 | 0.1 | 0.3 | 290 |
| 108*88.4*4.8 | 0.1 | 0.3 | 400 |
| 113*92.4*4.5 | 0.1 | 0.3 | 400 |
| 257*149*8.5 | 0.1 | 0.3 | 750 |
| 75.98*54.2*3 | 0.1 | 0.3 | 130 |
| 55*42*2 | 0.1 | 0.3 | 100 |
| 142.9*97.8*6 | 0.1 | 0.3 | 500 |
| 187*97.8*5.9 | 0.1 | 0.3 | 500 |
| 46*45*2 | 0.1 | 0.3 | 144 |
| 376*184*6 | 0.1 | 0.3 | 310.5 |
| 328*160*6 | 0.1 | 0.3 | 144 |
| 45*35*2 | 0.1 | 0.3 | 144 |
| 247.93*78*2 | 0.1 | 0.3 | CPU:70W GPU:90W |
| 286.65*49.3*2 | 0.1 | 0.3 | CPU:55W GPU:80W |
| 152*104.9*2.5 | 0.1 | 0.3 | CPU:90W GPU:210W |
| 286.65*48.93*1.8 | 0.1 | 0.3 | CPU:55W GPU:80W |
| 280*65.8*2 | 0.1 | 0.3 | CPU:55W GPU:105W |
| 121.69*48*3.31 | 0.1 | 0.3 | CPU:55W GPU:115W |
| 252*114.14*2.32 | 0.1 | 0.3 | CPU:43W GPU:80W |
| 352.7*149.5*3 | 0.1 | 0.3 | CPU:60W GPU:175W |
| 135.33*132.44*3.5 | 0.1 | 0.3 | CPU:70W GPU:150W |
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