The thermal module is an essential component used for managing and regulating the temperature of devices or systems. Its primary function is to effectively dissipate the heat generated by various components, preventing overheating and ensuring that the device operates within a safe working temperature range. The thermal modules typically include components such as heat sinks, fans, heat spreaders, vapor chamber, slim vapor chamber and heat pipes. It can be used individually or combined to form a complete heat dissipation system. The modules are indispensable in many industrial and technological applications, ensuring the normal operation of equipment and extending its lifespan.
The thermal module is an essential component used for managing and regulating the temperature of devices or systems. Its primary function is to effectively dissipate the heat generated by various components, preventing overheating and ensuring that the device operates within a safe working temperature range. The thermal modules typically include components such as heat sinks, fans, heat spreaders, vapor chamber, slim vapor chamber and heat pipes. It can be used individually or combined to form a complete heat dissipation system. The modules are indispensable in many industrial and technological applications, ensuring the normal operation of equipment and extending its lifespan.
Advantages & Characteristics
Forcecon has a wide of range thermal module components and a very complete portfolio of products. The components are vertically integrated with Forcecon designs, manufactures and quality controls. The components include the following: fan, heat sink, heat pipe, heat spreader, vapor chamber and 3D vapor chamber.
Heat Pipe Solution
Utilizing multiple heat pipes to efficiently extract high thermal energy from the chip end. Power ranges from 220~350W
Vapor Chamber Solution
The vapor chamber solution effectively extract high-density thermal energy from the chip end. Power ranges from 220~400W.
Heat Pipe + Vapor Chamber
In combination of heat pipe and vapor chamber, device heat is evenly distribute high thermal density, followed by rapid extraction by heat pipes. Power ranges from 250~500W .
3D Vapor Chamber
3D vapor chamber : Using a heat pipe combined with a uniform temperature plate, the increased air convection area is used to improve better heat dissipation efficiency. The power range is 300~800W.
Product Reference
| Thermal Module for Datacenter & Telecomm | |||
| Equipment | Chassis Height | CPU TDP | GPU TDP |
| INTEL Processor AMD Processor NVIDIA Processor |
2U | ~500W | 700-1200W |
| 4U | ~700W | ||
| Network Switch | 1U | 950W | |
| Low-orbit Satellite | 6mm |
150W(L350*W340mm)~ 350W(L400*W388mm) |
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| Listed but not limited. Custom Design Available. | |||
(Click for more info on Server Thermal Module Components)
Server Spec Sheet Reference
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Intel Server
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AMD Server
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