Market Introduction

The continuous improvement in the performance of mobile phones has led to a higher demand for heat dissipation. As mobile phones continue to evolve towards being lighter and thinner, innovation in thermal technology becomes imperative. In the future, mobile phone thermal solution is expected to transition from heat pipes to Slim Vapor Chamber (SVC) to provide superior performance, as well as a lighter and thinner form factor. The thermal parts of foldable phones will also evolve from traditional two-piece SVC to a single flexible SVC, adapting better to the folding structure and ensuring stable heat conduction. Simultaneously, thermal materials are becoming more diverse, including copper, FCCL (Flexible Copper-Clad Laminate), copper alloys, and stainless steel. This not only enhances durability but also effectively reduces the overall weight of the mobile phone. With a focus on technological innovation, FCN is committed to providing advanced solutions for mobile phone thermal technology, striving to remain a leader in the industry.

Application: Smartphone / Foldable Phone / Tablet / Consumer Electronics